JTEKT Technology Days, September 14 and 15, will showcase the company’s passion for advanced manufacturing solutions at the company headquarters in Arlington Heights, IL. Visitors will enjoy unprecedented access to the products, technologies, and dedicated people that drive JTEKT’s global operation—while enjoying the company’s hospitality throughout.

JTEKT Toyoda Americas Corporation has recently introduced its FH5000 series of three high-speed horizontal machining centers (HMC), including the FH5000S HMC with 800X800X880 mm (x, y, z) strokes, 900mm workpiece diameter, and 1100mm workpiece height capacity. The FH5000 series machines include a 500mm table capable of handling 1000 kg loads. 

JTEKT recently demonstrated a new double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. The DXSG320 performance represents a massive improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today which grind to 3-4 microns, according to the company.